Renesas Emulation Pod M306H2T-RPD-E Informations techniques télécharger pdf (Page 54)

( 52 / 76 )

Chapter 5. Specifications

5.1 Specifications

Table 5.1 lists the specifications of the M306H2T-RPD-E.

Table 5.1 Specifications of the M306H2T-RPD-E

PC4701

M16C/6H Group M306H2

M30622SAFP, M306H2MC-TOOL

Single-chip mode

Memory expansion mode

Microprocessor mode

1 MB

10 MHz

-X

OUT

Internal oscillator circuit board (OSC-3)

Switchable to external oscillator input.

CIN

-X

COUT

Internal oscillator circuit board (OSC-2)

Switchable to external oscillator input.

4.75 to 5.25 V

5 to 35°C (no dew)

-10 to 60°C (no dew)

Supplied from PC4701

Refer to "3.7 Connecting the Target System" (page 43).

• U.S. EMI standards (FCC part 15 Class A)

• CE marking (EN55022, EN50082-1)

Emulators

Applicable MCUs

Evaluation MCU

Usable modes

Emulation memory

Maximum operating frequency

Clock supply

Operating voltage

Operating temperature

Storage temperature

Power supply to emulation pod

Connection to target system

Overseas standards

1 2 ... 49 50 51 52 53 54 55 56 57 58 59 ... 77 78

Pas de commentaire

Renesas Emulation Pod M306H2T-RPD-E Informations techniques Page 54