Renesas H8SX1664 Informations techniques Page 1

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology C

4.2.Board Dimensions The following diagram gives the board dimensions and connector positions. All through hole connectors are on a common 0.1” grid

Chapter 5.Block Diagram Figure 5.1 shows the CPU board components and their connectivity. MicrocontrollerUser: 4 LEDS1Green, 1Orange, 2RedApplicat

Chapter 6.User Circuitry 6.1.Switches There are four switches located on the CPU board. The function of each switch and its connection are shown in T

Description Function Fit For E8 Remove for E8 Fit for RS232 Remove for RS232 SCI4 Tx Programming Serial Port R6 R37 R37 R6 SCI4 Rx Program

6.6.Option Links Table 6-5 below describes the function of the option links contained on this CPU board. The default configuration is indicated by BO

Option Link Settings Reference Function Fitted Alternative (Removed) Related To R34 Serial Port Configuration Connects serial port D5 (Tx) to D

Option Link Settings Reference Function Fitted Alternative (Removed) Related To R59 Application Board Interface Use RxD0 of application board int

Option Link Settings Reference Function Fitted Alternative (Removed) Related To R85 Application Board Interface Use IO5 of application board inte

Option Link Settings Reference Function Fitted Alternative (Removed) Related To R129 Boot Mode Selection Enables E8 to control the boot mode sel

6.9.USB Port This RSK has a Full-speed (12 Mbps) USB port compliant to USB 2.0 specification. It is available as J12 on the RSK. This port allows Boo

Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to chang

Chapter 7.Modes The CPU board supports User mode and Boot mode. User mode may be used to run and debug user code, while Boot mode may only be used to

7.1.1.Boot mode The boot mode settings for this CPU board are shown in belowTable 7-2 : FDT Settings MD2 MD1 MD0 LSI State after Reset End A B

7.1.2. User Mode For the device to enter User Mode, reset must be held active while the microcontroller mode pins are held in states specified for Us

Chapter 8.Programming Methods All of the Flash ROM on the device (i.e. both MATs) can be programmed when the device is in Boot mode. Once in boot mod

The Flash Development Toolkit (FDT) is supplied to allow programs to be loaded directly on to the board using this method. Please select USB Direct i

Chapter 9.Headers 9.1.Microcontroller Headers Table 9-1 to show theTable 9-4 microcontroller pin headers and their corresponding microcontroller c

J2 Pin Circuit Net Name Device Pin Pin Circuit Net Name Device Pin 1 A1 37 2 A0 38 3 EMLE 39 4 PM3 40 5 PM4 41 6 UC_VCC 32 7 No connect

J3 Pin Circuit Net Name Device Pin Pin Circuit Net Name Device Pin 1 D7 73 2 UC_VCC 64 3 D8 75 4 D9 76 5 D10 77 6 D11 78 7 Ground 79

J4 Pin Circuit Net Name Device Pin Pin Circuit Net Name Device Pin 1 TRSTn 109 2 UC_VCC 99 3 TMS 111 4 Ground 96 5 TDI 113 6 TCK 114 7 MD0

9.2.Application Headers Table 9-5 and belowTable 9-6 show the standard application header connections. JA1 Pin Generic Header Name CPU board Sig

Renesas Starter Kit for H8SX1664User’s ManualUser’s ManualRev.1.00 2006.08RENESAS SINGLE-CHIP MICROCOMPUTERH8SX FAMILY

JA3 Pin Generic Header Name CPU board Signal Name Device Pin Pin Generic Header Name CPU board Signal Name Device Pin 1 Address Bus A0 38 2 A

JA5 Pin Generic Header Name CPU board Signal Name Device Pin Pin Generic Header Name CPU board Signal Name Device Pin 1 AD4 AN4 124 2 AD5 AN5

Chapter 10.Code Development 10.1.Overview Note: For all code debugging using Renesas software tools, the CPU board must either be connected to a PC s

Section Description Start Location Size (H’bytes) RESET_VECTOR HMON Reset Vector (Vector 0) Required for Start-up of HMON H’ 0000 0000 0x0004 SC

10.7.Memory Map The memory map shown in this section visually describes the locations of program code sections related to HMON, the FDT kernels and t

10.8.Baud Rate Setting HMON is initially set to connect at 250000Baud. The value set in the baud rate register for the microcontroller must be altere

Chapter 11. Component Placement 34

Chapter 12. Additional Information For details on how to use High-performance Embedded Workshop (HEW), refer to the HEW manual available on the CD o

Renesas Starter Kit for H8SX1664 User's Manual Publication Date Rev.1.00 Published by: Renesas Technolo

1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 JapanRenesas Starter Kit for H8SX1664REG10J0025-0100User’s Manual

Table of Contents Table of Contents ...

10.6. HMON Code Size ...

Chapter 1. Preface Cautions This document may be, wholly or partially, subject to change without notice. All rights reserved. No one is permitted t

Chapter 2.Purpose This RSK is an evaluation tool for Renesas microcontrollers. Features include: • Renesas Microcontroller Programming. • User Cod

Chapter 3.Power Supply 3.1.Requirements This CPU board operates from a 5V power supply. A diode provides reverse polarity protection only if a curren

Chapter 4.Board Layout 4.1.Component Layout The following diagram shows top layer component layout of the board. JA3JA5 JA1JA6 JA2J1J3J2User LEDsPow